Abstract
A comprehensive numerical study of tensile deformation on electro-deposited Cu with nano-scale growth twins is presented using a conventional theory of mechanism-based strain gradient plasticity (CMSG). Systematic research on the size effects of growth twins in Cu polycrystalline is carried out. The roles of many material parameters which affect the size effects, such as grain sizes, Young’s modulus, twin/matrix lamellar structures aspect ratio and volume fraction, as well as the plastic strain hardening exponent, are presented.
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