Simulation of copper nanoindentation using LAMMPS - atomic to micro-scale

Abstract

This study explores the mechanical properties of copper at the nanoscale through molecular dynamics simulations of nanoindentation using LAMMPS. Focusing on atomic-scale interactions, the research investigates the relationship between indentation depth and pressure, considering factors like indenter shape and application rate. The simulations reveal complex material behaviors diverging from classical Hertzian contact theory, highlighting the intricacies of nano-scale mechanical responses. The study contributes significantly to the understanding of copper’s mechanical properties and the application of computational simulation in material science.