Abstract
The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and thermal capabilities. In order to support the development of these novel semiconductors, packaging technologies are evolving to provide enough reliable products. Silver sintering is one of the most promising technologies for die attach. Due to their superior reliability properties with respect to conventional soft solder compounds, dedicated reliability flow and physical analyses should be designed and employed for sintering process optimization and durability assessment. This paper proposes an experimental methodology to optimize the pressure value applied during the silver sintering manufacturing of a silicon carbide power MOSFET molded package. The evaluation of the best pressure value is based on scanning electron microscopy performed after a liquid-to-liquid thermal shock reliability test. Furthermore, the sintering layer degradation is monitored during durability stress by scanning the acoustic microscopy and electric measurement of a temperature sensitive electric parameter. Moreover, mechanical elastoplastic behavior is characterized by uniaxial tensile test for a bulk sample and finite element analysis is developed to predict the mechanical behavior as a function of void fraction inside sintering layer.
Highlights
The current diffusion of high-performance hybrid and electrical vehicles is pushing semiconductor industries to engineer novel chip based innovative materials
The same behavior is observed for other sample cross-sections, which are not reported for the sake of brevity
The assessment was based on a liquid-to-liquid thermal shock (TS) test and on dedicated physical analyses (SEM, scanning acoustic microscopy (SAM) and electric measurements) aiming to check and monitor sintering layer degradation during the reliability stress
Summary
The current diffusion of high-performance hybrid and electrical vehicles is pushing semiconductor industries to engineer novel chip based innovative materials. Silicon carbide (SiC), offer a concrete option for the development of devices with higher efficiency and temperature capability with respect to the classic silicon (Si) based. The introduction of these improved semiconductors is strongly related with the evolution of packaging manufacturing. Packaging improvement is needed to withstand the strict requirements in terms of performance, efficiency and durability [2]
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