Abstract
In this paper, we demonstrate a silicon-based packaging platform for a package component of Light Emitting Diode (LED) using silicon bulk micromachining technique and using the silicon substrate with embedded solder interconnections to dissipate heat and the match thermal expansion coefficient (CTE). The objective is to develop an LED package that can overcome life time, high operating voltage, package degradation and has the ability to drive the devices at higher power and higher brightness. The results reported in before show that the silicon substrate can enhance heat removal for safe junction temperature operation and minimize thermal stress caused by mismatch of CTE. Moreover, silicon-based packaging platform with embedded solder interconnections has been fabricated in this study, and this technique can be used for packaging conventional optoelectronic semiconductor devices such as laser diode or MEMS devices.
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