Abstract
Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+ e− Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2% X0 per layer in the vertex detector and 1–2% X0 in the tracker. A fast time slicing of 10 ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25×25 μm2 and 55×55 μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50 μm–500 μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.
Highlights
Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+e Compact Linear Collider (CLIC)
A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D e ort
The hit position on the Device Under Test (DUT) was determined by charge interpolation between the pixels in a matched cluster, applying an ⌘-correction to correct for non linear charge sharing e ects [11]
Summary
To achieve the required low material budget and single point resolution in the vertex detector, very thin planar sensors with small pixel sizes are investigated. Test-beam and simulation results from Timepix and Timepix ASICs with a pixel size of 55 x 55 μm, as well as CLICpix ASICs with a pixel size of 25 x 25 μm are presented
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