Abstract
A novel method of a fluxless, high precision and reliable Au/Au thermo compression flip chip bonding process for optoelectronic devices has been developed. The main technologies for the manufacturing of multichannel optical modules are based on the height control within 0.5 /spl mu/m of electro plated Au bumps on silicon motherboards in the close environment of v-grooves, the flip chip bonding applying low pressure at temperatures below 300/spl deg/C and reproducible passive fiber array alignment with high coupling efficiencies. A coupling loss of 8.5 dB has been achieved, which is very close to the active alignment result of 8.1 dB. The reliability of flip chip bonded laser and photo diodes has been investigated by ageing and temperature cycling tests, where no shift of the threshold current occurred, the coupling efficiency did not vary and the dark current showed no degradation. The RF performance of the electrical interconnection on the silicon motherboard has been analysed and a transmission experiment at 622 Mbit/s has been done successfully.
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