Abstract

Silicon sensors and their corresponding readout electronics have been designed in the framework of the LHCb Ring-Imaging Cherenkov detector project. They are specified to detect low-energy photoelectrons created by Cherenkov light incident on a hybrid photon detector. The design of the sensor and electronics will be described, in particular the specific steps taken to meet the special requirements of the detector. Measurements on the electronics will be presented, together with results from assemblies constructed with sensor and electronics chips using a special bump-bonding technique tailored to match the detector fabrication process.

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