Abstract
Rutherford backscattering of energetic 4He+ ions has been used to study the composition and depth profile of silicide layers formed when thin nickel films evaporated on (111) and (100) silicon surfaces are heated in a nitrogen-hydrogen ambient. In the temperature range 297 to 430 degrees C two phases are seen to form sequentially. The growth of the first phase, Ni2Si, is parabolic with time, whilst the second, NiSi, grows linearly with time. The simultaneous presence of both diffusion and reaction-rate-limiting mechanisms is implied by the parabolic and linear growth laws. An investigation of the electrical characteristics of diodes which were metallized and heat-treated simultaneously shows little change in the barrier height.
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