Abstract

Titanium nitride layers were prepared by gas absorption and reactive r.f. sputtering. In the gas absorption method, a Ti foil was heated at 540 – 740 °C under nitrogen pressure of 1 – 5 × 10 −3 torr. A UHV microbalance was utilized to observe an absorption process of nitrogen gas and showed that there were two processes in Ti nitridation. The absorption rate curve obeyed a linear rate law in the initial stage and then followed a parabolic rate law. Depth profile measurements of the coatings by XPS along with argon ion sputter-etching revealed that the nitride film followed the parabolic law had a thick and uniform nitride layer ( N Ti = 2 3 ) while the specimen following the linear law had the nitride layer only near the surface region and the concentration of nitrogen decreased sharply toward the bulk. On the other hand, a homogeneous nitride layer was easily prepared on Mo, 304 stainless steel and carbon substrates even at such low temperature as less than 150°C by the reactive r.f. sputtering method. The quantitative depth composition profile of the nitride layer was performed by means of RBS. It was found that the almost stoichiometric Ti-nitride (TiN) formed in the certain nitrogen partial pressure region.

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