Abstract
AbstractIntermetallic compound (IMC) growth is being analyzed due to its significant effect on solder joint reliability. It appears that from various works conducted whereby the excessive growth of IMC could lead to solder joint failure. Thus, many attempts have been made to determine the actual IMC thickness. Average values of IMC thickness are always used to represent the IMC layer. However, precise, and true representation of the IMC layer growth in the actual 3D phenomenon from 2D images remains unclear. Leading to this, the stereometry should be considered in determining the actual IMC thickness layer. The accuracy of the IMC layer thickness measurement is important as the IMC layer thickness values will be used for the next analysis such as for growth rate and activation energy calculation. Type of measurement to represent the actual IMC layer thickness based on 2D observation and nature of the IMC structure which contains hillocks and valleys is suggested.KeywordsIntermetallic compound layerIMC layer thicknessIMC layer thickness measurementStereometryQuantitative measurement
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