Abstract
Welcome to the Signal Integrity Column! In this issue, we will publish a summary by Prof. Mihai Telescu on SPI 2019. Mihai was the Chair of the 23rd IEEE Workshop on Signal and Power Integrity (SPI 2019) held in Chambery, France, on June 18 to 21, 2019. We have published a similar report before on the previous SPI Workshops, a well-known event in the field of Signal and Power Integrity held every year in Europe. It is one of a series of small conferences, including the IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) in the US and the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium in Asia. Together these conferences facilitate the gathering of researchers and engineers around the world to exchange ideas related to Signal and Power Integrity. The IEEE EMC Society has technically co-sponsored these conferences the past several years.
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