Abstract
Heterogeneous Integrated System in Display (HiSID) is a novel display architecture we proposed, in this scenario, screens, components or even the mainboard could be integrated into one module. Beyond the display, components such as computing units, storage units, interaction units and communication units can be combined with the display and then lead to a diverse functionality for the future terminal devices. Physically, this paradigm benefits from the highly-packed structure. But more importantly, according to our simulations, the key transmission path in HiSID would decrease by 80%, which then facilitate the increase of transmission speed by 5 times. To gain a holistic picture, we also systemically discussed the possible challenges for signal integrity, such as the tendency of signal crosstalk, insufficient materials resistivity and unideal thermal management design. Based on our study and discussions, we envision that, the signal integrity with ultra-low latency would enable HiSID with multiple applications.
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