Abstract

Heterogeneous integration system in display (HiSID) is a brand new architecture for the display. Based on the next-generation micro/mini-LED display technology, through semiconductor interconnection technology, advanced packaging, mass manufacturing and device miniaturization technologies, and so on, this system will integrate display units, storage units, sensing units, communication units, and even computing units into one “display.” Therefore, a light-weighted, intelligent, highly integrated, and everything-connected user-interface could be achieved. In this article, we first introduce the HiSID design architecture as well as its excellent performance and high efficiency on the panel area usage, which could progressively innovate the related industry chain. The ultralow latency, thermal, and reliability were simulated and discussed. To accomplish the HiSID, the key challenges such as device miniaturization, massive manufacturing, advanced interconnect technology, and required materials are reviewed.

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