Abstract
This paper provides an overview of the features and capabilities of state-of-the-art SiGe devices and BiCMOS technology for applications such as high-data-rate communications and pro-active safety systems like car-radar, identification and e-safety. The capabilities offered by SiGe-BiCMOS and microwave packaging enable the integration of complete transceivers on a chip or in a package even including the antenna. The criteria and trade-off's for the technology selection and system partitioning are described in the introduction. In addition to the electrical components performance, major criteria are addressed such as high reliability, long lifetime and high yield fabrication. Advanced packaging technologies are addressed as well, including embedded passive components and package co-design. Existing circuit design examples and future solutions for 77 GHz automotive radar are presented, followed by a multichannel receiver and a multichannel transmitter for mm-wave people scanners for airport security.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
