Abstract
向粉碎法制备的Bi0.5Sb1.5Te3+5%Te（质量分数）合金粉体中混入不同体积分数的SiC颗粒，利用放电等离子体烧结法制备SiC复合块体材料，探究块体材料组织和热电性能的变化规律。研究发现：随着SiC体积分数的增加，块体材料的取向性弱化，组织细化，载流子浓度增加，迁移率降低；由于取向性弱化及组织细化，加强了声子散射，降低了晶格热导率。SiC复合块体材料的电学性能的恶化，块体材料的无量纲热电优值（ZT）并未获得显著的提升；当SiC体积分数为0.40%时，块体材料在322 K时具有最优的无量纲热电优值（ZT=～0.81）。
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