Short-pulse propagation technique for characterizing resistive package interconnections

Abstract

A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin-film package interconnection structure. The measured line characteristics are then used in a transient circuit analysis program to predict output waveforms generated by logiclike signals. In the absence of modeling capabilities, the measured results can be used directly as input to circuit simulation programs. The authors illustrate this with the response of a 9.65-cm-long thin-film line to logiclike signals. >