Abstract

Laser ablation of solid targets by Ti:sapphire laser radiation is studied. The solid targets are irradiated by 0.2–5000 ps laser pulses in the intensity range of 10 9 − 5 × 10 16 W cm 2 . Dependences of the ablation depth on the laser pulse energy and pulse duration are discussed. Advantages of sub-picosecond laser radiation for precise material processing are demonstrated.

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