Abstract
Meeting FCC and CISPR 22 radiated EMI standards is a critical issue when designing and packaging electronics: (i) overshielding results in added cost, weight and design complexity; and (ii) undershielding can result in system qualification failures that could potentially delay a product introduction. There are many methods and materials available for shielding and enclosure design. In general, most methods work for most applications. However, the best and most cost effective shielding solution is generally one that is considered early in the design process. This paper will present shielding design alternatives using engineering thermoplastics, as well as compare application shielding requirements, shielding methods, processing considerations and cost. The results from a GE Plastics notebook shielding benchmark study (Operation Fulcrum) will be presented.
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