Abstract
Abstract As more components populate smaller board areas, the risk of unwanted coupling between components increases. Shielding and radiated emissions tests outlined by IEEE standards such as IEC 61000-4-21 and ASTM4935D identify measurement techniques to quantify shielding effectiveness. In a PCB topology, shields enclose components to create a Faraday cage, but necessitate a method to ground and fasten the shield to the PCB. Typical methods include the use of gaskets, sealants and clips. This paper reviews a gasket methodology and validates a parameterized ANSYS HFSS simulation with the measured relationship between gasket configuration and shielding effectiveness. Surface mount, rectangular, compressible gaskets manufactured by W.L. Gore & Associates, Inc. are used in several configurations to shield a PCB radiator. Radiated emissions measurements are performed in an ETS-Lindgren reverberation chamber to evaluate shielding effectiveness for each configuration. ANSYS HFSS, a full wave Finite Element Method (FEM) electromagnetic simulation solver, is used to simulate each geometric configuration and is verified with measured results.
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