Abstract
Silicon-photonic links are projected to replace the electrical links for global on-chip communications in future manycore systems. The use of off-chip laser sources to drive these silicon-photonic links can lead to higher link losses, thermal mismatch between laser source and on-chip photonic devices, and packaging challenges. Therefore, on-chip laser sources are being evaluated as candidates to drive the on-chip photonic links. In this paper, we first explore the power, efficiency and temperature tradeoffs associated with an on-chip laser source. Using a 3D stacked system that integrates a manycore chip with the optical devices and laser sources, we explore the design space for laser source sharing (among waveguides) and placement to minimize laser power by simultaneously considering the network bandwidth requirements, thermal constraints, and physical layout constraints. As part of this exploration we consider Clos and crossbar logical topologies, U-shaped and W-shaped physical layouts, and various sharing/placement strategies: locally-placed dedicated laser sources for waveguides, locally-placed shared laser sources, and shared laser sources placed remotely along the chip edges. Our analysis shows that logical topology, physical layout, and photonic device losses strongly drive the laser source sharing and placement choices to minimize laser power.
Paper version not known (Free)
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have