Abstract
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution characteristics of the stress and strain in solder joints under thermal cycle load were analyzed. Based on this, fatigue life of solder joints with different solder volumes was predicted. Analysis results show that under thermal cycling conditions solder joints of tiny concave acquired the best mechanical properties, and the its life is the longest.
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