Semiconductor devices “from inside”

Abstract

Operation of any semiconductor device can be presented by unique configuration of the electrical field (potential) and charge (doping) distribution within the device. More specifically, the status of operation is described by the quasi-Fermi energy (QFE) profile across the device. Visualization of the dynamic operation of the device and quantitative measurements of the QFE profile is provided by differential voltage contrast (DVC), which is a modification of the secondary electron imaging in a scanning electron microscope (SEM). The DVC consists of storing two images of a tested semiconductor device. Exposed to the electron beam is a cross section, for example, of a field effect transistor (FET). The first image, covering the entire inside of the FET from source to drain, is taken when the device is not biased. The second image of the same area is taken when the transistor is biased. The secondary electron signal is enhanced or retarded by actual distribution of a potential across the tested device. Subtraction pixel by pixel of the two carefully aligned images removes morphologic contrast from the screen, takes away surface features and contamination of the sample, and reveals the contribution of the electrical field to the changes of contrast. The calibration procedure allows measurement of the potential distribution with a precision of 0.05 V. The first derivative of a potential profile provides for distribution of the electrical field and the second derivative gives the doping profile across the tested device. A variety of semiconductor devices such as p-n junctions, Zener diodes, MOSFET's, MESFET's, solar cells and optical detectors, quantum well lasers, etc., were tested. Videotaping of the tested devices allows us to observe the changes in the electrical field and charge distribution as the device operates in a wide range of electrical or optical signals.