Abstract
Zinc oxide layer being thermally precipitated on glass and ceramic strips ( 2x2.5 cm ) before the electroless precipitation of copper utilizing the conventional Printed Circuit Boards( PCB) technologies in conjunction with the required modifications to optimize the quality of these layers . The roughness of ZnO films was Ra 0.02 µm and its thickness about 0.7 µm. The films being characterized by X- ray diffraction . The bivalent Pd( І І ) used as activator was reduced to Pd (0) on surface of ZnO layer by UV light in 1.5 – 2 minutes intervals . Copper lines precipitated in the subsequent steps have an adhesion power of 2and 5 kg.mm-2 on glass and ceramic respectively . The specific conductance of the electrolessly deposited copper was found to be( 5.3x106)ohm-1.cm-1, and the resistivity was ( 1.8 x10 -6)ohm.cm . From theresults of this study the method could be utilized in PCB fabrication
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