Abstract
ABSTRACTThis paper highlights a number of basic science issues related to wafer cleaning in silicon technology. Particle removal techniques, metal contamination, surface passivation, and integrated processing are used as key examples of areas of active research related to wafer cleaning. It is highlighted that wafer cleaning plays a far more significant role in device processing than just for contamination removal. However, even contamination removal faces formidable challenges such as the determination of safe contamination limits and the detection of trace amounts of contamination, all of which go well beyond the traditional realm of contamination control.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
