Scattering-induced circuit modelling and performance analysis of coupled hybrid Interconnections: Sub-threshold performance evaluation

Abstract

This paper presents the scattering induced circuit modelling and performance analysis in terms of crosstalk and frequency stability in the newly proposed hybrid interconnects operating in the sub-threshold domain. The electrical performances of hybrid copper carbon-nanotube (HCNT), hybrid copper graphene nanoribbon (HGNR) and hybrid Copper carbon (H Carbon) interconnects are examined and compared with that of copper (Cu), single walled carbon nanotube bundles (SWCNTs) and lithium doped multilayer graphene nanoribbon (MLGNR) interconnects in terms of dynamic and functional crosstalk results by employing the transmission line (TL) analytical model for sub-threshold applications. The impact of the grain-size on the resistivity of Cu and the various scatterings induced mean free path (MFP) on the overall resistance has been analysed in the modelling of HGNR interconnects. The comprehensive analysis of the crosstalk induced delay (dynamic crosstalk), the positive peaks and the time-duration (functional crosstalk) ensures the efficacy of hybrid interconnects, especially H Carbon interconnects in the designing of on-chip interconnects. It has also been observed from the frequency response that the maximum 3-dB bandwidth is obtained in the case of H Carbon hybrid interconnects (approx. 6.7586 × 1010 Hz) at 300 K temperature values. Further, the bandwidth values tend to decrease with the rise in temperature values.