Abstract
With the SUSS XRS 200 a synchrotron compatible stepper is available which combines high positional accuracy and high throughput using the scanning exposure method. With 1 s each for exposure, alignment, and stepping time, 20 6-in. wafers/h can be processed with the smallest stepfield size of 26×26 mm. The excellent linewidth control, irrespective of topography and surface characteristics, with a large gap and exposure dose window, show the capability of x-ray lithography to be used as the next generation production lithography method. The SUSS XRS-200 provides the user with a tool to take full advantage of this wide process latitude and make production of sub-half-micron features an economical operation.
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