Scaling limits of monolayer AlN and GaN MOSFETs

Abstract

The shrinking of transistors to ultra-scale limits is in great demand to extend Moore’s law, where the search for proper alternative channel materials is significant. The III-V group compounds are regarded as post-Si candidates for their high electron mobility. Herein, we simulate the monolayer (ML) AlN and GaN metal–oxidesemiconductor field-effect transistors (MOSFETs) with ab initio quantum transport simulation to evaluate their scale limit. The ML AlN and GaN MOSFETs exhibit much better n-type performances than their p-type counterparts, and the n-type ML AlN (GaN) MOSFETs can surpass the International Roadmap for Device and Systems (IRDS, 2022 version) lower-power (LP) and high-performance (HP) target for the year 2028 even at gate length (Lg) of 3 and 2 nm, respectively. Encouragingly, the optimal n-type ML AlN (GaN) MOSFETs possess the highest (second-highest) Ion against all studied n-type ML MOSFETs and propel the Lg limit that outperforms the International Technology Roadmap for Semiconductors (ITRS, 2013 version) LP and HP targets to 2 and 1 (2) nm, respectively.