Abstract
A Sand blasting technology has been used to address via and trench processing of glass wafer of optic semiconductor packaging. Manufactured sand blast that is controlled by blast nozzle and servomotor so that 8 wafer processing may be available. 10㎜ sq test device manufactured by Dry Film Resist (DFR) pattern process on 8 glass wafer of 500 ㎛'s thickness. Based on particle pressure and the wafer transfer speed, etch rate, mask erosion, and vertical trench slope have been analyzed. Perfect 500 ㎛ tooling has been performed at 0.3㎫ pressure and 100 rpm wafer speed. It is particle pressure that influence in processing depth and the transfer speed did not influence.
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