SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

Abstract

PurposeThe purpose of this paper is to study the manufacturing of SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after structure modification and also to investigate the added carbon nanotubes' influence on the technological properties and the microstructure of “nano” solder pastes. This work is a continuation of similar previous studies of SAC solder pastes with silver nanopowder additions.Design/methodology/approachThe authors applied functionalization and esterification methods for the structural modification of the carbon nanotubes. The “nano” solder paste preparation was performed with the use of a two‐stage method of carbon nanotube dispersion in “own‐manufactured” SAC 305 solder paste. To determine the technological properties of the “nano” solder paste, slump, solder ball, wetting and spreading tests were applied according to the existing standards. Standard metallographic procedures were applied for microstructural analysis.FindingsAs expected on the basis of the previous studies of SAC solder pastes with silver nanopowders, positive results were obtained for the own‐manufactured SAC 305 solder paste with carbon nanotubes by applying the dispersion method. Also applied were functionalization and esterification methods, whose results showed microstructural changes in the carbon nanotubes. The “nano” SAC solder pastes showed a positive influence on the slump properties, compared to the basic SAC solder paste. The authors proved a negative influence of the carbon nanotubes' addition (dependent on their concentration) on the spreading and wetting of the SAC solder paste on a copper substrate, which provoked the non‐wetting and dewetting phenomena. A slight improvement was observed for the “nano” SAC solder pastes with modified carbon nanotubes. The carbon nanotubes' presence in the solder paste showed a positive effect on the growth reduction of the IMCs' thickness, which depended on the type.Research limitations/implicationsThe authors intend to verify the reinforcement effect of the alloys with carbon nanotubes suggested in the literature (the aim of Part II). For this purpose, an assembly process with RC electronic elements on PCBs with Ni/Au and SAC (HASL) finishes will be performed, with the use of the SAC 305 solder paste with modified carbon nanotubes, for the purpose of reflow soldering. Next, measurements of the mechanical strength of the solder joints and their microstructures will be conducted.Practical implicationsIt is suggested that further studies of the mechanical properties and the reliability of solder joints are necessary for the practical implementation of the “nano” SAC solder pastes, but taking into account the wetting data, the investigation should be performed only for “nano” pastes with the lowest additions of modified carbon nanotubes.Originality/valueThe paper demonstrates a method of “nano” solder paste preparation by means of a two‐stage dispersion of carbon nanotubes in the own‐manufactured SAC 305 solder paste and a comparison study of the properties of “nano” pastes with the basic SAC solder paste.