Abstract
We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-µm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184 mΩ/bump has been achieved at room temperature.
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