Abstract
The double cleavage drilled compression specimen was used to study the room‐temperature cyclic fatigue behavior of reaction‐bonded silicon nitride (RBSN). Fatigue results were compared with slow crack growth under static loading. The fatigue exponent for RBSN was found to be 40, although no slow crack growth occurred under static loading. The fatigue threshold for RBSN was as low as 0.5/Klc and dependent upon loading conditions. Crack growth behavior and electron microscopy provided evidence that the fatigue mechanism was due to asperity and debris wedging at the crack face.
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