Abstract
We investigated the dependence of implantation dose on the charge storage characteristics of large-area n-channel metal–oxide–semiconductor field-effect transistors with 1-keV Si+-implanted gate oxides. Gate bias and time-dependent source–drain current measurements are reported. Devices implanted with 1×1016 cm−2 Si dose exhibit a continuous (trap-like) charge storage process under both static and dynamic conditions. In contrast, for 2×1016 cm−2 implanted devices, electrons are stored in Si nanocrystals in discrete units at low gate voltages, as revealed by a periodic staircase plateau of the source–drain current with a low gate voltage sweep rate, and the step-like decrease of the time-dependent monitoring of the channel current. These observations of room-temperature single-electron storage effects support the pursuit of large-area devices operating on the basis of Coulomb blockade phenomena.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.