Abstract
Metallic conductive LaNiO3 thick films with a thickness of 0.5–10 μm were fabricated by a room-temperature-operating powder deposition process—aerosol deposition method. The coated LaNiO3 layers were fairly dense without pores or cracks, and maintained their phase stability due to low-temperature consolidation. The as-deposited LaNiO3 film consisted of ∼10-nm-diameter grains, with a sheet resistance of 10–100 Ω/□, while the post-annealed LaNiO3 film had a sheet resistance of 4.45 Ω/□, which is the lowest value ever reported for an LaNiO3 film. This excellent conductivity result was attributed to the high crystal stability and dense microstructure.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
