Role of Overpotential on Texture, Morphology and Ductility of Electrodeposited Copper Foils for Printed Circuit Board Applications

Abstract

A study was made to correlate different electrodeposition parameters, like, e.g., cathodic overpotential, bath composition, and bath ageing, with characteristics as crystallographic texture and roughness, and the ductility of electrolytic copper foils. Copper foils with a low (220) preferred crystallographic orientation, and a smooth surface are obtained when depositing at 87 to 113 mV cathodic overpotential from copper sulfate solutions with a low chloride content. Under these plating conditions copper foils with the highest ductility were achieved.