Abstract

A novel waffle-type nLDMOS-SCR ESD clamp with compact source and drain for high-voltage ESD protection is proposed and realised using the 0.35 µm, 30/5 V bipolar-CMOS-DMOS (BCD) process. With this new structure, a high ESD failure current of 4.4 A was achieved with a total channel width of only 60 µm. Considering the area efficiency, the waffle-type structure provides more than 30% higher current handling capability than the conventional ones. Because of its better robustness and area efficiency, the waffle-type structure should be a promising layout for high-voltage ESD protection applications.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.