RF Packaging and Design for Development of High Performance 5G mmWave Modules

Abstract

5G sub-6GHz networks have already been deployed in many regions around the world. However, the deployment of 5G mmWave networks is yet to meet expectations. This is partly because of the challenges associated with hardware development of 5G mmWave systems. One example of such a challenge is to overcome the severe degradation of signal-to-noise (SNR) ratio due to intra- and inter-system signal losses at mmWave frequencies. This deteriorates the signal quality, limits transmission distances and may lead to unreliable mobile communication. In this work, we present RF packaging platforms and technologies as well as an approach for scalability of 5G RF frontend integrated circuits (ICs) and antennas which overcome intra- and inter-system losses. This leads to the development of high-performance and scalable 5G MIMO (multiple input multiple output) modules for reliable mobile communication at mmWave frequencies. The platforms provide very short and low-loss signal paths with few geometrical discontinuities between the frontend ICs and antennas. This leads to significant reduction in signal reflections and attenuation, thus improving the matching efficiency of the antennas and the equivalent isotropic radiated power (EIRP) of the entire system. The platforms also enable antennas to be integrated on layers directly above the ICs, and thereby ensures scalability of the ICs and antennas in both lateral dimensions for 5G mmWave massive MIMO. To demonstrate the functionality of our proposed packaging platforms, technologies and antennas, we performed in-depth RF designs, measurements and characterization of packaging materials, technologies and platforms as well as antennas for 5G mmWave applications.