Abstract
Abstract In this paper, the improved power durability test system and method for an reliability analysis of SAW device is proposed and the failure mechanism through failure analysis is analyzed. As a result of the failure analysis using microscope, SEM and EDX, the failure mechanism of the SAW device is electromigration due to joule heating under high current density and high temperature condition. The electromigration makes voids and hillocks in the IDT electrode and the voids and hillocks can lead to short circuit and open circuit faults, respectively, increasing the insertion loss of an SAW filter. The accelerated life testing of the SAW filter for 450MHz CDMA application using the proposed power durability test system and method is carried out. B 10 lifetime of the SAW filter using Eyring model and Weibull distribution is estimated as about 98,500 hours. Key Words : SAW Device, Reliability, Failure Mechanism, Power Durability, Life Test, SAW Filter * 정회원, 한국전자통신연구원 사업화본부 ** 정회원, 한국전자통신연구원 사업화본부 접수일자 : 2014년 9월 12일, 수정완료 : 2014년 10월 6일게재확정일자 : 2014년 10월 10일Received: 12 September, 2014 / Revised: 6 October, 2014 Accepted: 10 October, 2014
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