Abstract
In 2008 Lead Free Package POP (Package on Package) will be a major new device to hit the streets and will challenge many to re-evaluate their soldering and rework products/processes. The implementation of lead-free in the commercial world and is well on the way in assembly plants worldwide and particularly in Asia. This represents a major logistics risk to commercial and aerospace community, while some are currently exempt from Lead Free legislation, they will be impacted by the use of Commercial-off-The-Shelf components finished with Lead Free component finishes. All POP is Lead free that I have seen. So if new POP memory devices are to be used in military equipments they will be lead free. Lead Free soldered electronics hardware requires higher processing temperatures than for traditional Tin Lead soldered hardware. The higher Lead Free soldering processing temperatures, coupled with faster production requirements increases the risk of board and component damage therefore requiring greater process control. The POP is another example of increased complexity especially in rework.
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