Abstract
Soldering is a well-known metallurgical joining method that uses a filler metal, the solder, with a melting point below 425°C. The trends toward to miniaturization in microelectronic packaging industries have motivated the development of high performance lead-free solders. However, the properties of the lead free solder cannot match the properties of lead solder. To overcome this problem, a dopant is added to the based lead free solder. In this paper, review on the effect of Gallium as doped was discussed.
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Schedule a callMore From: IOP Conf. Series: Materials Science and Engineering
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