Abstract
As electronic components continue to be miniaturized, the heat flux density continues to increase. Scholars have proposed the use of microchannel heat sinks (MCHS) to dissipate heat from devices with high heat flux density, and have pointed out that the heat dissipation capability of MCHS can be improved in two ways: using nanofluids with high thermal conductivity and optimizing the structure of MCHS. In this paper, the thermophysical parameters and thermo-hydraulic performance of nanofluids in microchannels are reviewed. Improving the heat dissipation of MCHS is analyzed and discussed in terms of both thermal properties and flow properties, respectively.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
