Abstract

The study of the influence of the nanoparticle volume fraction and aspect ratio of microchannels on the fluid flow and heat transfer characteristics of nanofluids in microchannels is important in the optimal design of heat dissipation systems with high heat flux. In this work, the computational fluid dynamics method was adopted to simulate the flow and heat transfer characteristics of two types of water-Al2O3 nanofluids with two different volume fractions and five types of microchannel heat sinks with different aspect ratios. Results showed that increasing the nanoparticle volume fraction reduced the average temperature of the heat transfer interface and thereby improved the heat transfer capacity of the nanofluids. Meanwhile, the increase of the nanoparticle volume fraction led to a considerable increase in the pumping power of the system. Increasing the aspect ratio of the microchannel effectively improved the heat transfer capacity of the heat sink. Moreover, increasing the aspect ratio effectively reduced the average temperature of the heating surface of the heat sink without significantly increasing the flow resistance loss. When the aspect ratio exceeded 30, the heat transfer coefficient did not increase with the increase of the aspect ratio. The results of this work may offer guiding significance for the optimal design of high heat flux microchannel heat sinks.

Highlights

  • Introduction and Ruijin WangWith the continuous miniaturization and integration of electronic devices, the heat flux density continues to increase, and conventional cooling methods are no longer effective

  • In 1995, Choi and Eastman [4] proposed the concept of nanofluids; a proportion of solid particles with diameters less than 100 nm were added into a base fluid with low thermal conductivity, and the resulting suspension with high thermal conductivity was found to be relatively stable

  • The results showed that the optimized microchannel with trapezoidal groove had the best heat transfer effect, the Nusselt number increased by 51.59% and the friction coefficient increased by 2.35% compared with the optimization

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Summary

Introduction

Introduction and Ruijin WangWith the continuous miniaturization and integration of electronic devices, the heat flux density continues to increase, and conventional cooling methods are no longer effective. In 1995, Choi and Eastman [4] proposed the concept of nanofluids; a proportion of solid particles with diameters less than 100 nm were added into a base fluid with low thermal conductivity, and the resulting suspension with high thermal conductivity was found to be relatively stable. This special liquid can significantly improve the convective heat transfer capacity of cooling media. Nanofluids contribute to the improvement of heat transfer processes and reduce and optimize thermal systems Different properties, such as wettability and thermal conductivity, can be adjusted by altering the nanoparticles’

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