Abstract
Abstract During the past decades, high-performance devices and setups have been widely used in the fields of precision optics, semiconductors, microelectronics, biomedicine, optoelectronics and aerospace. It is a challenge to achieve ultralow surface roughness free of damages. Due to the unique physicochemical properties of rare earths, ceria has garnered great progresses for atomic surfaces induced by chemical mechanical polishing. Compared with conventional mechanical removal by alumina and silica, rare earth abrasives achieve selective material removal on surface via their special chemical activity, without introducing microscopic scratches and defects. Nevertheless, polishing performance of rare earth abrasives depends on series of factors, e.g. size of abrasive particles, microscale topological structure, configuration of chemical slurry, auxiliary energy fields etc. As a result, it is significant to conduct a comprehensive review to understand state-of-the-art polishing technologies. This review summarizes the effect of polishing slurries composed of different rare earth abrasives on polishing performance under different conditions. Additionally, various energy-assisted polishing strategies are discussed using diverse kinds of rare earth abrasives for distinct polishing forms. Finally, future directions of polishing on rare earth abrasives are addressed.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
