Retraction: Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications

Abstract

Abstract The increasing power densities of certain semiconductor devices such as SiC and GaN require higher continuous use temperatures and high thermal properties. For example, one application is for a continuous use temperature of 300°C with SiC devices, with a die attach process at about 370°C. This paper describes development of an Ag/glass die attach paste which demonstrates high performance and reliability, for high temperature continuous use. The Ag/glass paste contains a unique crystallizing glass having a crystalline re-melt temperature of greater than 300°C and less than about 370°C. During the die attach process with Ag/glass paste, the crystallized glass component melts at about 350°C and wets the die and substrate surfaces. During the cool down of the die attach process, the glass crystallizes creating a robust structure having a re-melt temperature greater than 300°C. Therefore, die adhesion remains high for a 300°C continuous use temperature. Another key requirement of a die attach adhesive...