Development of a Ag/glass die attach adhesive for high power and high use temperature applications

Abstract

The increasing power densities of certain semiconductor devices such as SiC and GaN require higher continuous use temperatures and high thermal properties. For example, one application is for a continuous use temperature of 300°C with SiC devices, with a die attach process at about 370°C. This paper describes development of an Ag/glass die attach paste which demonstrates high performance and reliability, for high temperature continuous use.