Restoring retention form to rimmed trays

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Fig. 1. Solder obliterating under&t on new Rim-Lock tray (arrows). sion material inside the tray. During the manufacturing process, the bulk of the solder used to fix the wire to the tray often obliterates any form of retentive locking (Fig. 1). New trays should be carefully examined before use to assure proper retention is available. When excess solder is present, removal with a No. 33% or No. 2 bur will restore proper function to the tray (Fig. 2).