Abstract
The continuing advances of die technology of integrated circuits (IC) miniaturization bringing more complexity in the product. At unusual conditions one may encounter new challenges intrinsic to the structure of the package. The study aims to qualify a product such as multi-stacked dice configurations with baseline reference using same die technology. The only difference is the substrate layout in which defined for the electrical purpose. The challenge is to understand and resolve low intermetallic coverage (IMC) on each die which may lead to manufacturability and reliability problems over time.
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