Abstract
ABSTRACT In this work, Ta2O5 films were first deposited on Si substrates by reactive magnetron sputtering of a Ta metal target at various substrate temperatures, RF powers and sputtering pressures. The crystal characteristics of these films can be effectively tailored by controlling the sputtering process. Based on the optimized process parameters, tantalum oxide (TaOx) films with different oxygen component content were sputtered on ITO buffered Si substrates and comparatively investigated. The results show that the film with Ta/TaOx/ITO structure has a resistance switching (RS) behavior and its conduction mechanism is closely related to the O2-/O concentration related to the oxygen partial pressure at the dielectric layer and electrode interface. This study provides an in-depth understanding of the component/structure design and structure-activity relationship for high-performance TaOx-based resistive memory.
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