Abstract
We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit by Spice simulation. The simulation results show that resistive open defects of 1Ω and above can be detected by the test method with the power supply circuit.
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