Abstract
A RESET-first resistive switching mechanism based on a reduction reaction with a thermal annealing process was studied. Through high resolution transmission electron microscopy, electron disperse X-ray, and electron energy loss spectroscopy mapping, the manner in which the oxygen ions migrate at the interface between the HfO2 layer and the top Ti metal electrode during the electroforming, RESET, and SET processes was investigated. It is also demonstrated that the thermal annealing process produced RESET-first resistive switching behavior via the formation of a conductive path, indicating the redox reaction from Ti/HfO2 to TiOx/HfO2−x with the diffusion of oxygen atoms. RESET-first bipolar resistive switching behavior was associated with the formation of a conductive path via a thermal annealing process and the redox reaction of oxygen ions at the interface under external bias.
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