Abstract
With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.
Highlights
In recent decades, the application of traditional Sn-Pb binary alloy solder in electronic and electrical field has been prohibited gradually due to the toxic of lead (Pb) element [1, 2]
We presented a laconic summary of the transformation law of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys after the addition of nanometer particles
The relevant experimental results of these investigations demonstrated that the wettability and mechanical properties of Snbased lead-free composite solder alloys improved due to the addition of nanometer particles, which is associated with the refinement of microstructure
Summary
The application of traditional Sn-Pb binary alloy solder in electronic and electrical field has been prohibited gradually due to the toxic of lead (Pb) element [1, 2]. Trace amount of alloying elements (Ni [8,9,10], Mn [11], Bi [12], Co [13, 14], Cr [15], Al [9], Sb [10], Fe [16], and rare earth (RE) [17, 18]) is incorporated with Sn-based lead-free solder to enhance the comprehensive properties. The review is to summarize the influences of incorporating various nanometer particles on the performances (wettability, microstructure, and mechanical properties) of Sn-based lead-free composite solders in recent researches and supply some suggestions in the future research work
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